Low Surface Roughness Epic™ D2xx soft pads for CMP Applications

Konferenz: ICPT 2012 - International Conference on Planarization / CMP Technology
15.10.2012-17.10.2012 in Grenoble, France

Tagungsband: ICPT 2012

Seiten: 5Sprache: EnglischTyp: PDF

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Nair, Jay; Lu, Shaoning; Page, Joseph; Bigoin, Gilles; Sun, Fred; Gaudet, Greg (Cabot Microelectronics Corporation, 870 N. commons Drive, Aurora, IL 60504, USA)

Soft pads are increasingly adopted in IC manufacturing due to low defectivity requirements of the final step of CMP in each layer. When pad material is getting softer, most of the materials show lower polishing rate. In this paper, we are reporting initial results on improving defects and stable rate with D260 42D soft pads. Keywords: Epic D260, Contact size