Modeling the adhesion between nanoneedle surfaces bonded based on Velcro® or Gecko principle

Konferenz: Mikrosystemtechnik 2013 - Von Bauelementen zu Systemen
14.10.2013 - 16.10.2013 in Aachen, Deutschland

Tagungsband: Mikrosystemtechnik 2013

Seiten: 4Sprache: EnglischTyp: PDF

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Autoren:
Keshavarzi, Shervin (Department of Computer & Electrical Engineering and Institute of Applied Research, Furtwangen University, Robert-Gerwig-Platz 1, 78120 Furtwangen, Germany )
Mescheder, Ulrich (Department of Computer & Electrical Engineering and Institute of Applied Research, Furtwangen University, Robert-Gerwig-Platz 1, 78120 Furtwangen, Germany)
Reinecke, Holger (Department of Microsystems Engineering (IMTEK), University of Freiburg, Georges-Koehler-Allee 104, 79110 Freiburg, Germany)

Inhalt:
Understanding the interaction mechanisms between needle like surfaces is essential to employ such surfaces for room temperature bonding based on the Velcro(r) or gecko principles. Common contact mechanics approaches (JKR and DMT) can express the adhesion force between needle like surfaces for chip bonding applications. A new adhesion model focused on multi-asperity contact interaction considering the neighbors’ effect is presented and discussed in this paper. The theoretical evaluation is compared to the experimental results obtained from bonding of two Si needle like surfaces with an active area of 0,4096 cm2.