Robustness study of solder joints of different compositions by using Stochastic Finite Element Modeling
Konferenz: CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
25.02.2014 - 27.02.2014 in Nuremberg, Germany
Tagungsband: CIPS 2014
Seiten: 7Sprache: EnglischTyp: PDF
Persönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Autoren:
Aoues, Younes; Makhloufi, Abderahman; El-Hami, Abdelkhalak (National Institute Of Applied Sciences at Rouen (INSA-LOFIMS), 685 Avenue de l’Universite, Saint Etienne de Rouvray, 76801, France)
Pougnet, Philippe (Reliability Expert Valeo, 14 av Beguines, 95800 Cergy, France)
Inhalt:
Fatigue lifetime of eutectic SnPb and lead free solder joints is usually evaluated by deterministic models. These models do not take into account the uncertainties of model parameters, the variability of design parameters and the variability of operating conditions in service. In order to assess more accurately the robustness of critical solder joints of an automotive mechatronic device, a stochastic finite element model of solder joints is developed and its results are analyzed.