High-throughput DBC-assembled IGBT screening for power module
Konferenz: CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
25.02.2014 - 27.02.2014 in Nuremberg, Germany
Tagungsband: CIPS 2014
Seiten: 6Sprache: EnglischTyp: PDF
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Autoren:
Tsukuda, Masanori (The International Centre for the study of East Asian Development, 1-8 Hibikino, Wakamatsu-ku, Kitakyushu, Japan)
Okoda, Seiichi (COPER ELECTRONICS CO., LTD. 43 Funako, Atsugi, Japan)
Noda, Ryuzo (C.D.N. CORPORATION, 1-18-22 Ohtsubo-higashi, Miyazaki, Japan)
Tashiro, Katsuji (HOH KOH SYA Co., Ltd., 2-7-30 kamiitouzu, kokurakita-ku, kitakyushyu, Japan)
Omura, Ichiro; Tsukuda, Masanori (Kyushu Institute of Technology, 1-1 Sensui-cho, Tobata-ku, Kitakyushu, Japan)
Inhalt:
High-throughput DBC-assembled IGBT screening equipment for a production line is under development in order to prevent early failure of power modules. The equipment has been planning to have automatic GO/NO GO judgment technology by high-throughput measurement of current signal distribution with non-contact sensor arrays with small coils over the bonding wires of IGBT chips. Basic technology and Prototypes of a sensor, an analog amplifier, digital compensation technology, a test head and power circuit have been almost completed. The authors will fabricate the sensor arrays and develop GO/NO GO judgement technology with the integration of a basic technology.