Simultaneous Testing of Wirebond and Solder Fatigue in IGBT Modules

Inhalt:
Long-term reliability is a key requirement for IGBT modules. Wire bond and solder degradation are main aging mechanisms in IGBT modules. Here both failure modes are addressed in a single test. This combined test is closer to real applications than individual tests and it saves time and reduces number of samples needed. Furthermore, cycling capability information for large temperature swings is extracted. This becomes more and more relevant as junction temperatures are being pushed to higher and higher values, for both, Si and wide band gap devices.