Enhancing the contact interface by matching the surface pressure and current density distribution
Konferenz: ICEC 2014 - The 27th International Conference on Electrical Contacts
22.06.2014 - 26.06.2014 in Dresden, Deutschland
Tagungsband: ICEC 2014
Seiten: 6Sprache: EnglischTyp: PDF
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Autoren:
Leidner, Michael (Tyco Electronics AMP GmbH, Speyer, Germany)
Myers, Marjorie (TE Connectivity, Harrisburg PA, USA)
Schmidt, Helge; Sachs, Soenke; Stefan Thoss, (Tyco Electronics AMP GmbH, Bensheim, Germany)
Inhalt:
This article focuses on the differences in how the contact interface surface normal load and Current Density (J) are distributed across a 'Hertzian style' electrical contact interface. Structuring the contact interface in a way that the a-spots carrying the greatest load coincide with the outer perimeter contact a-spots with the greatest current density will lead to lower Contact Resistance (RC) Sn contacts. This effect is not as pronounced with more noble finishes.