The role of microstructure and surface topography in the electrical behavior of Sn-coated Cu contacts

Konferenz: ICEC 2014 - The 27th International Conference on Electrical Contacts
22.06.2014 - 26.06.2014 in Dresden, Deutschland

Tagungsband: ICEC 2014

Seiten: 6Sprache: EnglischTyp: PDF

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Autoren:
Trinh, Kim E.; Muecklich, Frank (Chair of Functional Materials, Saarland University, Saarbruecken, Germany)
Ramos-Moore, Esteban (Institute of Physics, Pontificia Universidad Catolica de Chile, Santiago 7820436, Chile)

Inhalt:
An electrical connector must present low and stable contact resistance while being highly resistant against mechanical wear. In order to achieve this we explore the effect of laser surface texturing (LST) on the static resistance of Sn-plated Cu contacts. We study the evolution of the electrical resistance between textured contacts and an Au-coated hemispherical tip under normal loading. The microstructure and topography of the contact surface was analyzed using white light interferometry (WLI), focused ion beam (FIB), scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDX). LST induces surface softening and reduced electrical contact resistance under loading. The resistance vs load behavior of the laser-textured contact follows the Holm model, indicating that plastic deformation governs the electrical resistance. We claim that avoiding surface material pile-up and that insulating layer collapse reduces the resistance hysteresis during operational mating and unmating cycles.