Numerical microstructure analysis of Ag/WC/C contact material

Konferenz: ICEC 2014 - The 27th International Conference on Electrical Contacts
22.06.2014 - 26.06.2014 in Dresden, Deutschland

Tagungsband: ICEC 2014

Seiten: 6Sprache: EnglischTyp: PDF

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Autoren:
Streit, Isabelle (Siemens AG, Low Voltage & Products, Regensburg, Germany)

Inhalt:
This study shows a method for the characterization of contact microstructures based on the quantitative classification of the micrographs and obtaining repeatable results, independently of the investigator. This microstructure analysis is conducted on Ag/WC/C-sintered contacts, on which microstructure fluctuations were observed. In the first instance, the image acquisition and processing parameters are determined experimentally with the help of a light microscope and image processing software. Then, the particle detection and analysis focus on the pure silver areas as the target objects. The classification criteria are defined based on the values of the object’s dimensions and form, as well as on the subjective appreciation of the microstructure. Finally, the plausibility and repeatability of the results achieved with this method are analyzed. These activities can be considered as a basis for implementation of a systematic and objective microstructure analysis for Ag/WC/C-contact material.