Thermal and mechanical simulations for the improvement of the lifespan of highly-integrated systems

Konferenz: ZuE 2015 - 8. GMM/ITG/GI-Fachtagung Zuverlässigkeit und Entwurf – Reliability by Design
21.09.2015 - 23.09.2015 in Siegen, Deutschland

Tagungsband: GMM-Fb. 83: ZuE 2015

Seiten: 7Sprache: EnglischTyp: PDF

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Autoren:
Heinig, Andy; Papaioannou, Dimitrios (Fraunhofer Institute for Integrated Circuits IIS, Design Automation Division EAS, Dresden, Germany)

Inhalt:
The thermal and mechanical behaviour is a critical aspect for electronic devices in general and for highly-integrated system in particular. In this paper we present different approaches based on simulations for the improvement of the lifespan of highly-integrated systems. As an example we applied our methods to an implantable stent with integrated electronics. The outcome of our work enables further design decisions in relation to the medical boundary conditions. Here we focus on the qualitative predictions with regard to mechanical and thermal stability. Furthermore, we suggest several design and technology related actions which can be taken to improve the mechanical and thermal behaviour of the investigated system. These suggestions concern, for example, the implementation of microbumps, a stress-relief layer for stress reduction or a silicone rubber that encapsulates the incorporated electronics in order to achieve better mechanical and thermal conditions.