Cost and Reliability Trade-off during the Development of Heterogeneous 3D-Systems
Konferenz: ZuE 2015 - 8. GMM/ITG/GI-Fachtagung Zuverlässigkeit und Entwurf – Reliability by Design
21.09.2015 - 23.09.2015 in Siegen, Deutschland
Tagungsband: GMM-Fb. 83: ZuE 2015
Seiten: 7Sprache: EnglischTyp: PDFPersönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Gruenewald, Armin; Wahl, Michael; Brueck, Rainer (University of Siegen, Siegen, Germany)
In the area of automotive, medical engineering, and smart, fully automated production processes called “Industrie 4.0” highly integrated technologies are required to fulfill the new challenges. For that matter heterogeneous systems play a decisive role. One possible solution to develop these systems is 3D-Integration, the vertical stacking of dies. It allows the use of a high number of short interconnects, which can result in higher performance and also higher reliability, e.g. by using redundancy. To achieve this, suitable test methods and techniques are necessary. Since the more complex technology and test scenarios result in higher cost, it is essential to find a trade-off between the desired reliability target and economic constraints. Therefore, first some background information about reliability in this context and domains that generate cost are given. After that, this paper proposes comprehensive cost modeling for 3D-ICs, which covers the whole production chain from the design stage to final test. The cost model has been implemented in the tool COMOA-3D which is able to analyze the costs of the different parts and compare different process and test flows in order to find a reliability and cost trade-off.