Damage protection of power modules

Konferenz: CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
08.03.2016 - 10.03.2016 in Nürnberg, Deutschland

Tagungsband: CIPS 2016

Seiten: 4Sprache: EnglischTyp: PDF

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Autoren:
Hohlfeld, Olaf (Infineon Technologies AG, Warstein, Germany)

Inhalt:
Short circuit events sometime occur in an electric power circuits having power modules. On a short circuit event a silicone filled power module can develop a force that can crack the module package depending on system DC link capacitance value and arrangement. The goal of this paper is to demonstrate the suitability of sand filling as a short circuit damage protection agent in power modules. The pressure reducing property of the sand filling which enables the damage protection is also explained. In addition to this, an experimental evaluation of the force reduction due to sand filling is also illustrated in this paper.