Application-specific micro Rogowski coil for power modules - Design tool, novel coil pattern and demonstration
Konferenz: CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
08.03.2016 - 10.03.2016 in Nürnberg, Deutschland
Tagungsband: CIPS 2016
Seiten: 5Sprache: EnglischTyp: PDF
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Autoren:
Koga, M.; Tsukuda, M.; Nakashima, K.; Omura, I. (Kyushu Institute of Technology, 1-1 Sensui-cho, Tobata-ku, Kitakyushu, Japan)
Tsukuda, M. (City of Kitakyushu ,1-8 Hibikino, Wakamatsu-ku, Kitakyushu, Japan)
Inhalt:
We developed a printed circuit board “Rogowski coil” to improve the reliability of power modules and packages. For the design, we used a new tool for sensitivity and adopted a fishbone coil pattern to realize design sensitivity. The developed coil demonstrates flat sensitivity that is as good as that of commercialized current probes/sensors because the proposed coil pattern successfully cancels noise from an outside current with flat signal sensitivity by an inside current.