Hybrid 2D/3D Photonic Integration for Non-Planar Circuit Topologies
Konferenz: ECOC 2016 - 42nd European Conference on Optical Communication
18.09.2016 - 22.09.2016 in Düsseldorf, Deutschland
Tagungsband: ECOC 2016
Seiten: 3Sprache: EnglischTyp: PDF
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Autoren:
Nesic, Aleksandar; Freude, Wolfgang (Karlsruhe Institute of Technology (KIT), Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe, Germany)
Blaicher, Matthias; Hoose, Tobias; Kutuvantavida, Yasar; Koos, Christian (Karlsruhe Institute of Technology (KIT), Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe & Institute of Microstructure Technology (IMT), Eggenstein-Leopoldshafen, Germany)
Lauermann, Matthias (Infinera Corporation, 140 Caspian Ct., Sunnyvale, California 94089, USA)
Inhalt:
We present a concept for realizing crossing-free photonic integrated circuits (PIC) using 3D freeform waveguides. We prove the viability of the approach using a silicon photonic 4 x 4 switch-and-select device. The method is applicable to a wide range of PIC technologies.