Nanotechnology meets temperature-sensitive devices

Konferenz: Mikro-Nano-Integration - 6. GMM-Workshop
05.10.2016 - 06.10.2016 in Duisburg, Deutschland

Tagungsband: GMM-Fb. 86: Mikro-Nano-Integration

Seiten: 4Sprache: EnglischTyp: PDF

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Freitag, J.; Winzer, A. T.; Käpplinger, I.; Ortlepp, T. (CiS Forschungsinstitut für Mikrosensorik GmbH Erfurt, Germany)
Vogel, K. (Fraunhofer ENAS Chemnitz, Germany)
Dietrich, G. (Fraunhofer IWS Dresden, Germany)

In its properties as a low-temperature technology the reactive bonding technology has been successfully implemented in the field of MOEMS applications for the first time. CiS Research Institute developed a high performance lighting unit (muHBS), and has been able to transfer the innovative reactive bonding technology from the laboratories of the research institute into production. Within the micro-optical system variant, the challenge was to add the assembly technology of a temperature sensitiv laser emitter (chip). Due to the IRMS a solution was developed which allowed a connection of the sensitive laser emitter in flip-chip technology.