Making use of synthetic diamond layers for 3d micro- and nanoelectronic applications

Konferenz: Mikro-Nano-Integration - 6. GMM-Workshop
05.10.2016 - 06.10.2016 in Duisburg, Deutschland

Tagungsband: GMM-Fb. 86: Mikro-Nano-Integration

Seiten: 4Sprache: EnglischTyp: PDF

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Autoren:
Baehr, Mario; Klein, Thomas; Taeschner, Robert; Ortlepp, Thomas (CiS Forschungsinstitut für Mikrosensorik GmbH, Konrad-Zuse-Str. 14, 99099 Erfurt, Germany)

Inhalt:
Synthetic diamond layers featuring superior material properties. We explain a process sequence to structure a layer synthetic diamond on a silicon substrate by means of fs-laser illumination to produce degenerated areas in the diamond with a very high amount of graphite and amorphous carbon. These graphitic structures were selectively removed by reactive ion etching – the remaining diamond layer serves as masking layer for further processes steps, e.g. silicon deep etching. Since diamond is a material of a certain hardness that cannot easily be machined, the laser scribing using an ultra-short-pulsed laser works precise and selectively and acts as a direct imaging technology. Micro-structures can be produced making use of this processing sequence.