In situ imaging of local corrosion cells on copper fine wires in solutions
Konferenz: ICPT 2017 - International Conference on Planarization/CMP Technology
11.10.2017 - 13.10.2017 in Leuven, Belgium
Tagungsband: ICPT 2017
Seiten: 4Sprache: EnglischTyp: PDF
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Autoren:
Takatoh, Chikako (Ebara Corp., 4-2-1 Honfujisawa, Fujisawa-shi, Kanagawa 251-8502 JAPAN)
Ogata, Shoichiro (Ebara Corp., 4-2-1 Honfujisawa, Fujisawa-shi, Kanagawa 251-8502 JAPAN & Kanazawa Univ., Kakuma-machi, Kanazawa, Ishikawa 920-1192 JAPAN)
Kitagawa, Takuya; Okamoto, Takahiro (Kanazawa Univ., Kakuma-machi, Kanazawa, Ishikawa 920-1192 JAPAN)
Inhalt:
The corrosion of fine copper wires is a serious problem in the semiconductor industry . We employed open-loop electric potential microscopy to investigate nanoscale structural and potential changes in copper wires caused by corrosion in aqueous electrolytic solution s. Our experiments confirmed that local corrosion of cells occurred even when the surface structure did not show any detectable changes. Keywords: In situ imaging, local corrosion cell, electric potential microscopy