Investigation of Mass Transfer Speed Theory on chemical mechanical polishing

Inhalt:
Abstract: A more complete theoretical system about chemical mechanical planarization (CMP) of the single material or various materials in the same plane was proposed， which studied from the mechanics, tribology, physics, physical chemistry, materials engineering, microelectronics engineering, chemistry, computer and other disciplines, comprehensively. And with the theoretical direction, the adjustable engineering technology and materials can apply different products was researched, which achieved higher cost performance and multiplier effect. Keywords: Mass transfer speed, theory, chemical mechanical polishing