Density Evaluation of Sub-100 nm Particles by Using Ellipsometry
Konferenz: ICPT 2017 - International Conference on Planarization/CMP Technology
11.10.2017 - 13.10.2017 in Leuven, Belgium
Tagungsband: ICPT 2017
Seiten: 5Sprache: EnglischTyp: PDF
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Autoren:
Kondoh, Eiichi; Suzuki, Katsuya; Jin, Lianhua (Univesrity of Yamanashi, Kofu 4008511, Japan)
Hamada, Satomi; Shima, Shohei; Hiyama, Hirokuni (Ebara Corporation, Tokyo 1448511, Japan)
Inhalt:
The paper reports the detection of sub-100 nm particles, attached on Si wafers, with ellipsometry. Particle attachement was carried out by using an industryal ink-jet printer that enables precise, accuratre and reproducible particle attachement. Accuracy of the ink-jet attachment was confirmed by fulorecese microscopy. Good correlation between the change of ellipsometric parameters and particle density was confirmed. Our results evidence practical application of ellipsometry to particle denisty evaluation in laboratory researches. Keywords: Ellipsometry, Particle detection, Si wafer, Fluorescence microscopy, Inkjet printer