W CMP Tiny Particle Reduction Solution
Konferenz: ICPT 2017 - International Conference on Planarization/CMP Technology
11.10.2017 - 13.10.2017 in Leuven, Belgium
Tagungsband: ICPT 2017
Seiten: 4Sprache: EnglischTyp: PDF
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Autoren:
Li,Kun; Wang, Tongqing; Lu, Xinchun (State Key Laboratory of Tribology, Tsinghua University, Beijing 100084, China)
Zheng, Shumao (Hwatsing Technology Co.,Ltd, #8 Building,No.9 Juxing Rd,HaiHe Sci-tech Park,Jinnan District, Tianjin, China)
Inhalt:
As the size of ultra large scale integrated circuits continue to scale down, W plug becomes much thinner. The tiny particle (<0.1um) between the W plug couldn’t be removed efficiently by mega sonic or brush module. The particle will cause the W plug shortage and lead to yield lost issue. The traditional clean method is MEG using SC1, brush 1 module using NH4OH and brush 2 module using HF. This clean method is suffering the W tiny particle issue seriously. 95% pattern wafer particle count will be hundreds. This paper provides the low-cost, high- efficiency solution to resolve this particle issue by reverse the chemical sequence and recipe development.