Highly Efficient Cleaning Formulations for Removing Ceria Slurry Residues in Post-CMP Applications
Konferenz: ICPT 2017 - International Conference on Planarization/CMP Technology
11.10.2017 - 13.10.2017 in Leuven, Belgium
Tagungsband: ICPT 2017
Seiten: 4Sprache: EnglischTyp: PDF
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Autoren:
Bernatis, Paul (DuPont EKC Technology, Hayward CA, 94545)
Lin, Jhih-Fong; Tai, Pei-Yu; Lin, Yi-Han; Bai, Chia-Hui; Tseng, Yi-Hao; Yen, Chi (DuPont EKC Technology, Hsinchu Taiwan, Taiwan, R.O.C., 30078)
Kuroda, Akira (DuPont Electronics & Communication, Kawasaki, 213-0012, Japan)
Inhalt:
This paper describes advanced formulated chemistries that reduce the defect levels on TEOS and SiNx blanket wafers in some cases by more than 70% relative to commodity based chemicals. The cleaning effectiveness of the commodity chemical based cleans and the highly efficient formulated chemistries will be compared for different defect types such as small molecule inorganic and organic contaminants as well as larger defects including slurry particles which are detected by light scattering metrology. Furthermore, how the defect levels for each class of residues varied and was reduced with different chelates, pH adjusters, and particle and surface modifiers will be discussed. Keywords: post-CMP, Ceria, STI, cleaning