Proposal of Spraying Pure Water Method under the Electric Field and Its Behavior Observation in the Cleaning Process of CMP

Konferenz: ICPT 2017 - International Conference on Planarization/CMP Technology
11.10.2017 - 13.10.2017 in Leuven, Belgium

Tagungsband: ICPT 2017

Seiten: 5Sprache: EnglischTyp: PDF

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Autoren:
Fujimoto, Masanori; Uneda, Michio (Kanazawa Institute of Technology, 7-1, Ohgigaoka, Nonoichi, Ishikawa, 921-8501, Japan)

Inhalt:
The current state of the field necessitates the development of a desktop-type cleaning apparatus for the next generation substrate. In the spin cleaning method, there are many advantages, such as less wasted water, because it does not require dipping treatment of the cleaned substrate, and less retention of contaminated washing liquid, because this method allow for short cleaning times. Furthermore, it can also be applied to future small substrates, such as a diamonds. The purpose of this study is to clarify the function of spraying the pure cleaning water under the electric field while rotating the substrate in the spin cleaning, to demonstrate the motion behaviors as basic characteristics. In this paper, we investigate the spraying droplet formation pattern and its velocity by the voltage applied to make the electric field. As a result, the influences on the speed and the scattering range to the applied voltage were revealed from a series of our experimental considerations. Keywords: Cleaning Process, Electric Field, Spraying Pure Water Method, Velocity of jetted droplet, Ejection angle