BiCMOS Embedded Microfluidic Technology Based on Wafer Bonding Techniques for Biosensor Applications
Konferenz: MikroSystemTechnik 2017 - Kongress
23.10.2017 - 25.10.2017 in München, Deutschland
Tagungsband: MikroSystemTechnik 2017
Seiten: 4Sprache: EnglischTyp: PDF
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Autoren:
Inac, Mesut (Technical University Berlin, HFT4, Einsteinufer 25, 10587 Berlin Germany & IHP, Im Technologiepark 25, 15236 Frankfurt (Oder), Germany)
Wietstruck, Matthias; Goeritz, Alexander; Cetindogan, Barbaros; Baristiran-Kaynak, Canan; Marschmeyer, Steffen; Fraschke, Mirko; Voss, Thomas; Mai, Andreas (IHP, Im Technologiepark 25, 15236 Frankfurt (Oder), Germany)
Palego, Cristiano (Bangor University, Bangor, LL57 1UT, United Kingdom)
Pothier, Arnaud (XLIM — UMR 7252, University of Limoges/CNRS, 87060 Limoges, France)
Kaynak, Mehmet (IHP, Im Technologiepark 25, 15236 Frankfurt (Oder), Germany & Sabanci University, Orta Mahalle, Universite Caddesi 27, Tuzla, 34956 Istanbul, Turkey)
Inhalt:
In this paper, a 200 mm wafer level integration of microfluidics together with a high performance SiGe BiCMOS process is presented. Using high throughput 200 mm wafer level semiconductor processing steps and wafer bonding techniques, Lab-on-Chip (LoC) systems with combination of Si microfluidics and BiCMOS electronics are realized. A low temperature fusion bonding at 300 °C and an adhesive bonding are applied to integrate these technologies together. Based on the BiCMOS microfluidic integration technique, the electrical and microfluidic interfaces are separated from each other enabling highly miniaturized LoC systems. This developed technology helps to reduce the costs and increase the sensitivity which satisfy the needs of LoC systems.