Integration solutions for clean and safe switching of high speed devices

Konferenz: CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
20.03.2018 - 22.03.2018 in Stuttgart, Deutschland

Tagungsband: ETG-Fb. 156: CIPS 2018

Seiten: 11Sprache: EnglischTyp: PDF

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Autoren:
Schanen, Jean-Luc; Jeannin, Pierre-Olivier (Univ. Grenoble Alpes, CNRS, Grenoble INP, G2Elab, F-38000 Grenoble, FRANCE)

Inhalt:
This paper investigates the impact of stray elements (inductance, capacitance) on the switching behavior. Voltage overshoots, ringing, EMC, losses are under concern. Positive effects as well as negative ones in the case of very high speed commutations are underlined, resulting in design rules for packaging. Afterwards a case study of several power modules is proposed, showing various solutions of many authors to provide packaging solutions adapted to the new high speed devices.