Thermistor Die for Power Module Applications

Konferenz: CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
20.03.2018 - 22.03.2018 in Stuttgart, Deutschland

Tagungsband: ETG-Fb. 156: CIPS 2018

Seiten: 6Sprache: EnglischTyp: PDF

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Autoren:
Schuurman, Sophie; Mattens, Erik; Beneden, Bruno Van (VISHAY Resistors, Brussels, Belgium)
Mattiuzzo, Emilio; Turnaturi, Marcello (VISHAY Semiconductor Italiana, Borgaro T.se, Italy)

Inhalt:
In power electronic devices, the temperature of the semiconductor die is one of the most critical parameters and has to be measured precisely. In many power modules, negative temperature coefficient (NTC) thermistors are integrated as temperature sensors for module temperature measurements and overtemperature protection. This paper examines new wire‐bondable, totally lead‐(Pb)‐free NTC thermistor dies and compares them to conventional designs like NTC SMD or NTC MELF versions. Their thick film electrode is newly developed and considered the key factor for the enhanced characteristics of the product.