Ferrite embedding for Power SiPs – a packaging view

Konferenz: CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
20.03.2018 - 22.03.2018 in Stuttgart, Deutschland

Tagungsband: ETG-Fb. 156: CIPS 2018

Seiten: 6Sprache: EnglischTyp: PDF

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Autoren:
Thomas, Tina; Schneider-Ramelow, Martin (Technical University Berlin, Microperipheric Center, Gustav-Meyer-Allee 25, 13355 Berlin, Germany)
Hoffmann, Stefan; Becker, Karl-Friedrich; Walter, Hans; Bader, Volker; Braun, Tanja; Hoene, Eckart (Fraunhofer Institute for Reliability and Microintegration, Gustav-Meyer-Allee 25, 13355 Berlin, Germany)

Inhalt:
This paper presents an investigation of mechanical interaction between Epoxy Mold Compounds (EMC) and magnetic cores. The verification is realized by the identification of core material property changes during molding employing core loss measurements before and after this technological process. A suitable loss measurement method is introduced and ferrite analysis on macroscopic and microscopic scale are provided. Finally, the results are discussed and conclusions for the design of magnetic components in Power SiPs are drawn.