Simulation of the Thermal Transient Behaviour of Silicon Carbide Modules Using Liquid Convection Cooling

Konferenz: CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
20.03.2018 - 22.03.2018 in Stuttgart, Deutschland

Tagungsband: ETG-Fb. 156: CIPS 2018

Seiten: 5Sprache: EnglischTyp: PDF

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Autoren:
Mueter, Ulf; Hoffmann, Klaus F. (Helmut Schmidt University, Hamburg, Germany)
Radvan, Jens; Richter, Stefan (Philips Medical Systems GmbH, Hamburg, Germany)

Inhalt:
This paper presents a FloEFD computational fluid dynamics (CFD) simulation to evaluate the transient thermal behaviour of liquid cooled silicon carbide power modules based on ceramic substrates. These power modules are used to increase the power density of high voltage generators for medical or industrial applications by using the insulating liquid for cooling and thereby avoiding bulky heatsinks. These modules also enable a higher switching frequency of the inverter within the high voltage generator compared to state-of-art systems which allows a size reduction of the passive components.