Fabrication of PCB Embedded 1200V/50A Power Module and Benchmarking with Commercial DBC-based Package
Konferenz: CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
20.03.2018 - 22.03.2018 in Stuttgart, Deutschland
Tagungsband: ETG-Fb. 156: CIPS 2018
Seiten: 6Sprache: EnglischTyp: PDFPersönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Sharma, Ankit Bhushan; Schnur, Johann; Haag, Niko; Kuwan, Thomas; Stogel, Armin; Huesgen, Till (Electronics Integration Lab, Hochschule Kempten, University of Applied Science, Bahnhofstr. 61, 87435 Kempten, Germany)
This paper presents a novel fabrication concept for PCB embedded power semiconductors. Here, the semiconductors are attached to an insulated metal substrate, which is embedded in a second step into an almost-ready PCB. This approach avoids handling of bare dies during PCB production. To demonstrate the feasibility of the concept, a 1200 V / 50 A B6 bridge is designed and fabricated. The performance is evaluated and benchmarked. Compared to a conventional DBCbased power module, the conduction losses are reduced by 21% and the thermal resistance is reduced by 29%. Turn-off losses are 25% lower, while turn-on losses are about the same for both module types. A further optimization of the switching performance is possible, but requires a reduced DC-link inductance and an optimization of the gate resistance.