On the reliability of stacked metallized ceramic substrates under thermal cycling

Konferenz: CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
20.03.2018 - 22.03.2018 in Stuttgart, Deutschland

Tagungsband: ETG-Fb. 156: CIPS 2018

Seiten: 6Sprache: EnglischTyp: PDF

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Mouawad, Bassem; Li, Jianfeng; Castellazzi, Alberto; Johnson, C. Mark (Power Electronics, Machines and Control Group, University of Nottingham, Nottingham NG7 2RD, United Kingdom)

The stacked metallized ceramic substrate has been reported as a novel compact layer structure for power electronic packaging. In this paper, a reliability study on two stacked substrates was presented using thermal cycling. Under thermal cycling conditions from -55 to 195 °C, the stacked DBC substrate was delaminated after 124 cycles, where in the case of the stacked AMB substrate, no detachment of the Cu layer was observed even after 3000 cycles. However, some deformation of the Cu layer occurred and cracks propagation have been observed in the ceramic of the stacked AMB substrates.