Thermal Characteristic Evaluation and Transient Thermal Analysis of Next-generation SiC Power Module at 250 °C

Konferenz: CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
20.03.2018 - 22.03.2018 in Stuttgart, Deutschland

Tagungsband: ETG-Fb. 156: CIPS 2018

Seiten: 6Sprache: EnglischTyp: PDF

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Autoren:
Imakiire, Akihiro; Kozako, Masahiro; Hikta, Masayuki (Kyushu Institute of Technology, 1-1 Sensui-cho, Tobata-ku, Kitakyusyu, Fukuoka, 804-8550, JAPAN)
Inagaki, Masakazu; Iizuka, Tomonori (IPS Research Center, Waseda University, 2-7 Hibikino, Wakamatsu-ku, Kitakyushu-shi, Fukuoka, 808-0135 JAPAN)
Narimatsu, Hiroaki; Sato, Nobuaki; Shimizu, Koji; Ueda, Kazutoshi (Mitsui High-tec Inc., 2-10-1 Komine, Yahatanishi-ku, Kitakyushu-shi, 807-8588 JPAN)
Sugiura, Kazuhiko; Tsuruta, Kazuhiro; Iida, Makio (DENSO CORPORATION, 500-1Minamiyama, Komenoki, Nisshin-shi, 470-0111 Aichi JAPAN)
Toda, Keiji (TOYOTA MOTOR CORPORATION, 543, Kirigahora, Nishihirose-cho, Toyota, Aichi 470-0309 JAPAN)

Inhalt:
In recent years, the demand for the operation of SiC power modules under high temperatures has emerged. The authors have so far investigated prototype SiC power modules using Ni micro plating bonding [NMPB] for junction temperatures driven at 250 °C. This paper presents the thermal characteristics and transient thermal analysis of a prototype novel SiC power module using NMPB, and compares with those of the conventional structure power module using high-temperature solder. Furthermore, we attempt to estimate and analyze the thermal resistance in a power module using a structure function derived from transient thermal analysis to discuss the delamination or void formation caused by a power cycling test.