Direct Copper Bonding (DCB) alumina substrates with preapplied solder pads for simplified die soldering and improved manufacturing yield

Konferenz: CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
20.03.2018 - 22.03.2018 in Stuttgart, Deutschland

Tagungsband: ETG-Fb. 156: CIPS 2018

Seiten: 2Sprache: EnglischTyp: PDF

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Autoren:
Richter, Hans-Juergen; Liu, Pan (Materials Solutions R&D, Heraeus Deutschland GmbH & Co. KG, Heraeusstr. 12 – 14, 63450 Hanau, Germany)
Schaefer, Michael (Paste Product Development R&D, Heraeus Deutschland GmbH & Co. KG, Heraeusstr. 12 – 14, 63450 Hanau, Germany)
Fritzsche, Sebastian (Organic Materials R&D, Heraeus Deutschland GmbH & Co. KG, Heraeusstr. 12 – 14, 63450 Hanau, Germany)
Watzal, Dieter (Analytic Physical, Heraeus Deutschland GmbH & Co. KG, Heraeusstr. 12 – 14, 63450 Hanau, Germany)
Fery, Christophe (Customers Solutions, Heraeus Deutschland GmbH & Co. KG, Heraeusstr. 12 – 14, 63450 Hanau, Germany)

Inhalt:
Nowadays, solder pastes are widely used to attach the chips on the substrates for power applications. However, this process suffers three major drawbacks. The first one is the removal of flux residues which requires a delicate cleaning step and uses expensive chemicals. The second one is the yield loss due to the splattering of solder during vacuum reflow. Last but not least, binder of solder paste is made of natural substances that vary from batch to batch requiring requalification from time to time.