A Novel Double Sided Cooled Leadframe Power Module for Automotive Application based on ceramic-free Substrates

Konferenz: CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
20.03.2018 - 22.03.2018 in Stuttgart, Deutschland

Tagungsband: ETG-Fb. 156: CIPS 2018

Seiten: 6Sprache: EnglischTyp: PDF

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Autoren:
Ngoc An, Bao; Kaestner, Peter; Meisser, Michael; Leyrer, Benjamin; Demattio, Horst; Blank, Thomas; Weber, Marc (Institute for Data Processing and Electronics (IPE), Karlsruhe Institute of Technology (KIT), Karlsruhe, Germany)
Noetzel, Dorit; Hannemann, Thomas (Institute for Applied Materials (IAM), Karlsruhe Institute of Technology (KIT), Karlsruhe, Germany)
Scherer, Torsten (Institute of Nanotechnology (INT), Karlsruhe Institute of Technology (KIT), Karlsruhe, Germany)
Mail, Matthias (Institute of Crop Science and Resource Conversation (INRES)-Horticultural Science, University of Bonn, Bonn, Germany)
Kolb, Johannes (SHARE at KIT – Schaeffler Technologies AG & Co. KG, Karlsruhe, Germany)

Inhalt:
A novel leadframe based power module concept with double sided cooling (DSC) is presented. The DSC module is attached to pin fin coolers using epoxy based insulation sheets. Three different insulation sheets are evaluated. The material analysis of the insulation sheets reveals that alumina particles enhance the thermal performance of the epoxy material significantly. The thermal simulations show that the presented power module offers a lower thermal resistance from chip to coolant of 0.116 K/W than a commercial ceramic based DSC power module. One prototype leadframe power module is set up and characterized to validate the thermal simulation results.