Current filament monitoring under unclamped inductive switching conditions on real IGBT interconnection
Konferenz: CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
20.03.2018 - 22.03.2018 in Stuttgart, Deutschland
Tagungsband: ETG-Fb. 156: CIPS 2018
Seiten: 5Sprache: EnglischTyp: PDFPersönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Tsukuda, Masanori (Green Electronics Research Institute, 1-8 Hibikino, Wakamatsu-ku, Kitakyushu, JAPAN)
Arimoto, Takaaki; Omura, Ichiro (Kyushu Institute of Technology, 2-4 Hibikino, Wakamatsu-ku, Kitakyushu, JAPAN)
Destruction under unclamped inductive switching is typical, catastrophic destruction phenomena. We used our original printed circuit board Rogowski sensor and monitored current filaments in IGBT under unclamped inductive switching conditions at emitter pads of IGBT devices. The current filament varied a little by switching condition. Even with the same switching condition, the current varied a little from sample to sample. Temperature and photoemission monitoring was sufficient to analyse a major current filament under unclamped inductive switching condition from the standpoint of time resolution. The spatial resolution of current monitoring should be improved to monitor minor phenomena of current filaments.