Direct Pressed Die (DPD) Technology - a Novel Packaging Solution for Power Modules

Konferenz: CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
20.03.2018 - 22.03.2018 in Stuttgart, Deutschland

Tagungsband: ETG-Fb. 156: CIPS 2018

Seiten: 5Sprache: EnglischTyp: PDF

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Autoren:
Goebl, Christian; Bellu, R.; Vennebusch, C. (Semikron Elektronik GmbH, Sigmundstr. 200, 90431 Nuremberg, Germany)

Inhalt:
New application fields for high power inverter systems like wind generators, hybrid cars and electrical vehicles require new ways of power electronics integration and packaging. The stringent requirements in size and weight, durability, ambient temperature, and environment are driving the power electronics beyond the limits of today’s industrial applica-tions. In industrial power modules, solder and bond wires are still the standard joining technologies of power dies today. These technologies are reaching their reliability limits when die temperatures are pushed above 175 °C. In this pa-per the authors will discuss how the environmental conditions drive silicon power device selection and packaging tech-nologies. Extreme cooling conditions and high power densities require a package design that needs to work at the ther-mal and electrical limits of the components without making any compromise in reliability and durability.