PCB-Embedding for GaN-on-Si Power Devices and ICs

Konferenz: CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
20.03.2018 - 22.03.2018 in Stuttgart, Deutschland

Tagungsband: ETG-Fb. 156: CIPS 2018

Seiten: 6Sprache: EnglischTyp: PDF

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Autoren:
Reiner, Richard; Weiss, Beatrix; Meder, Dirk; Waltereit, Patrick; Gerrer, Thomas; Quay, Ruediger (Fraunhofer Institute for Applied Solid-State Physics (IAF), Tullastr. 72, 79108 Freiburg, Germany)
Vockenberger, Christian (AT&S Austria Technologie & Systemtechnik AG (AT&S), Fabriksgasse 13, 8700 Leoben, Austria)
Ambacher, Oliver (University of Freiburg (INATECH), Emmy-Noether-Str. 2, 79110 Freiburg, Germany)

Inhalt:
This paper investigates a printed circuit board (PCB)-embedding technology as packaging technology for 600 V class GaN-on-Si power devices and power integrated circuits (ICs). The electrical and thermal characteristics of PCB-embedding are investigated and compared to conventional assemblies based on wire-bonding and soldering.