Highly Reliable Power Modules by Pressureless Sintering

Konferenz: CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
20.03.2018 - 22.03.2018 in Stuttgart, Deutschland

Tagungsband: ETG-Fb. 156: CIPS 2018

Seiten: 5Sprache: EnglischTyp: PDF

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Autoren:
Waltrich, Uwe; Bayer, Christoph Friedrich; Zoetl, Stephanie; Tokarski, Adam; Zischler, Sigrid; Schletz, Andreas (Fraunhofer IISB, Schottkystr. 10, 91058 Erlangen, Germany)
Maerz, Martin (Fraunhofer IISB, Schottkystr. 10, 91058 Erlangen, Germany & University of Erlangen-Nuremberg, Chair of Electron Devices, Cauerstr. 6, 91058 Erlangen, Germany)

Inhalt:
In this work a novel highly robust pressureless sintered top side leadframe technology for extensive chip sizes over 1 cm2 will be presented. Power cycling tests demonstrate superior power cycling capability compared to conventional wire bonded as well as pressure assisted sintered top side contacts. The assembly process steps will be explained and differences of both sinter technologies will be pointed out. The applied leadframe shows special perforation patterns, enabling the required oxidation of pressureless silver sintering pastes. FEM simulations were executed for investigating the influence of different perforations of the leadframe on the thermo-mechanical stress on the top side sinter layer. Furthermore the results of the power cycling tests and the failure mechanism of two different leadframe designs in combination with both silver sintering technologies are shown.