Power Electronic Integration and packaging for aeronautic application in harsh environment

Konferenz: CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
20.03.2018 - 22.03.2018 in Stuttgart, Deutschland

Tagungsband: ETG-Fb. 156: CIPS 2018

Seiten: 7Sprache: EnglischTyp: PDF

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Autoren:
Meuret, Regis (Safran Electrical & Power, Rond-Point René Ravaud, 77551 Moissy Cramayel, France)
Martineau, Donatien; Youssef, Toni (Safran Tech, 1 Rue des Jeunes Bois – Châteaufort, 78772 Magny-les-Hameaux, France)
Martin, Christian; Yade, Ousseynou (Laboratoire Ampere, Université Claude Bernard 43, Boulevard du 11 Novembre 1918, 69622 Villeurbanne, France)

Inhalt:
Studies and trends to go towards the More Electrical Aircraft concept have started several years ago. In this scope, last airplanes developments with the A380, A350, B787 and research programs highlight different trends, optimizations and realisations: - Electrical actuator in harsh environment, - Variable frequency network - Double voltage power network - Electrical air conditioning system - Electrical braking system.