Miniaturized Integrated Sensor Modules for Harsh Environments

Konferenz: Sensoren und Messsysteme - 19. ITG/GMA-Fachtagung
26.06.2018 - 27.06.2018 in Nürnberg, Deutschland

Tagungsband: ITG-Fb. 281: Sensoren und Messsysteme

Seiten: 4Sprache: EnglischTyp: PDF

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Autoren:
Bihler, Eckardt; Hauer, Marc (DYCONEX AG, Bassersdorf, Switzerland)

Inhalt:
Liquid Crystal Polymer (LCP), a thermoplastic dielectric film material with very low water absorption (< 0.04%), high chemical stability and low thermal expansion is best suited both as a substrate material and as the encapsulate for small miniaturized electronic modules. LCP stands out among other polymer materials used for microelectronics. The permeability for water and gases is the lowest among all polymeric materials. With proper design considerations LCP packages can achieve a sufficient hermeticity for exposures in harsh environments.