Surface-Mount Package IPM with Highly Reliable Transfer Molding Resin
Konferenz: CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
24.03.2020 - 26.03.2020 in Berlin, Deutschland
Tagungsband: ETG-Fb. 161: CIPS 2020
Seiten: 5Sprache: EnglischTyp: PDF
Autoren:
Hodaka, Rokubuichi,; Harada, Hiroyuki; Hiramatsu, Seiki (Advanced Technology R&D Center, Mitsubishi Electric Corporation, Japan)
Sakamoto, Ken; Iwai, Takamasa (Component Production Engineering Center, Mitsubishi Electric Corporation, Japan)
Kosugi, Akira; Shikano, Taketoshi (Power Device Works, Mitsubishi Electric Corporation, Japan)
Inhalt:
A surface-mount package IPM (intelligent power module) has been developed. A reverse conducting IGBT and highly thermal conductive transfer molding resin were used to minimize package size and reduce the cost. For surface-mount type devices, hygroscopic reflow resistance is a key issue and the developed module can satisfy moisture sensitivity level (MSL) 3 due to the improvement of adhesion property of the transfer molding resin. The device reliability was evaluated by H3TRB and HTRB, and it was proven that a highly reliable surface-mount package IPM could be realized.