Low voltage switching cell for high density and modular 3D power module with integrated air-cooling
Konferenz: CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
24.03.2020 - 26.03.2020 in Berlin, Deutschland
Tagungsband: ETG-Fb. 161: CIPS 2020
Seiten: 6Sprache: EnglischTyp: PDF
Bikinga, Wendpanga Fadel; Deffous, Walid; Mezrag, Bachir; Derbey, Alexis; Dumas, Florian; Sarrazin, Benoit; Avenas, Yvan (Univ. Grenoble Alpes, CNRS, Grenoble-INP, G2Elab, 38000 Grenoble, France)
This paper presents the TAPIR (compacT and modulAr Power modules with IntegRated cooling) power module technology based on dual side air-cooling, the heat sinks acting as electrodes of power devices. Used with a large number of power semiconductor devices, this technology improves the cooling performances while maintaining low stray inductances in switching cells. It is therefore suited to high-speed devices and allows increasing the density of power converters. A low-voltage switching cell is designed and electrically and thermally tested. The weight of the semiconductor and thermal management parts of a three-phase inverter made with TAPIR technology is estimated and compared with more classical packaging approaches.