Smart Ultrasonic Welding in Power Electronics Packaging

Konferenz: CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
24.03.2020 - 26.03.2020 in Berlin, Deutschland

Tagungsband: ETG-Fb. 161: CIPS 2020

Seiten: 6Sprache: EnglischTyp: PDF

Hunstig, Matthias; Schaermann, Waldemar; Broekelmann, Michael; Holtkaemper, Sebastian; Siepe, Dirk; Hesse, Hans J. (Hesse GmbH, Paderborn, Germany)

Ultrasonic metal spot welding is a standard technology used in power electronics packaging, mostly for welding power terminal connectors to direct bonded copper (DBC) substrates. Ultrasonic wire bonding is a very similar technology, yet there are significant differences regarding processes, applications, and available equipment. Production equipment combining the ultrasound power of welders with the flexibility, precision, and process control of wire bonders into a “smart welding process” is highly desired. This contribution compares the technologies and presents process results for a cylindrical cell battery pack. They highlight the advantages of smart over classic ultrasonic welding and demonstrate that smart ultrasonic welding and wire bonding have individual strengths and weaknesses