Loop formation effects on the lifetime of wire bonds for power electronics
Konferenz: CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
24.03.2020 - 26.03.2020 in Berlin, Deutschland
Tagungsband: ETG-Fb. 161: CIPS 2020
Seiten: 6Sprache: EnglischTyp: PDF
Autoren:
von Ribbeck, Hans-Georg (F & K DELVOTEC Bondtechnik GmbH, 85521 Ottobrunn, Germany)
Doehler, Torsten (Technical University of Applied Sciences Wildau, 15745 Wildau, Germany)
Czerny, Bernhard; Khatibi, Golta (Christian Doppler Laboratory for Lifetime and Reliability of Interfaces in Complex Multi-Material Electronics, TU Wien, 1060 Wien, Austria)
Geissler, Ute (University of Applied Sciences Wildau, 15745 Wildau, Germany)
Inhalt:
In the present work, the influence of loop forming aspects on the reliability of US-bonded aluminium heavy wires was studied, combining three measurement techniques, for the first time: Laser confocal microscopy based wrinkling characterization, accelerated lifetime measurements BAMFIT and destructive pull tests. The focus of this study was the systematic investigation of the heel region of the wire bond depending on process parameters and especially on the loop geometry regarding durability and lifetime. As first results, effects reducing durability were identified which are not apparent in normal testing and a recommendation for the use of reverse movements can be given.