Dealing with hierarchical partitioning in bottom-up design methodologies

Konferenz: SMACD / PRIME 2021 - International Conference on SMACD and 16th Conference on PRIME
19.07.2021 - 22.07.2021 in online

Tagungsband: SMACD / PRIME 2021

Seiten: 4Sprache: EnglischTyp: PDF

Autoren:
Passos, F. (Instituto de Microelectrónica de Sevilla, IMSE-CNM (CSIC/Universidad de Sevilla), Sevilla, Spain & Instituto de Telecomunicações, Lisboa, Portugal)
Saraza-Canflanca, Pablo; Castro-Lopez, Rafael; Roca, Elisenda; Fernandez, Francisco V. (Instituto de Microelectrónica de Sevilla, IMSE-CNM (CSIC/Universidad de Sevilla), Sevilla, Spain)

Inhalt:
This paper deals with the expertise blend of circuit design and design methodology development required to successfully address hierarchical partitioning of analog, radiofrequency and mm-Wave circuits in bottom-up design methodologies. A set of guidelines for the optimal configuration of the bottom-up process is discussed. Two case studies are used to demonstrate that these guidelines yield sound design results.