Film transfer from thin films to metal surfaces using sol-gels, self-assembling monolayers and water glass
Konferenz: MikroSystemTechnik Kongress 2021 - Kongress
08.11.2021 - 10.11.2021 in Stuttgart-Ludwigsburg, Deutschland
Tagungsband: MikroSystemTechnik Kongress 2021
Seiten: 4Sprache: EnglischTyp: PDF
Basten, Robin G.; Zawacka, Aleksandra M.; Bengsch, Sebastian (Institute of Micro Production Technology, Gottfried Wilhelm Leibniz University Hanover, Germany)
Prediger, Maren S. ; Wurz, Marc Christopher
Equipping large industrial components with metrological thin film sensors is challenging due to the size of the component, the locations of the sensor placement and the working environment, and is associated with considerable effort. A transfer process for conductive structures using polyvinyl alcohol (PVAL) as a transfer substrate was developed at the IMPT. To extend the existing range of applications to include conductive, functional metallic materials, the transfer of metallic thin films to metal surfaces is being investigated using two different joining strategies: on the one hand, bonding via self-assembling (SAMs) monolayers in combination with sol-gels and, on the other hand, via inorganic high-temperature adhesives.