Miniaturized Infrared lenses by wafer bonding technologies

Konferenz: MikroSystemTechnik Kongress 2021 - Kongress
08.11.2021 - 10.11.2021 in Stuttgart-Ludwigsburg, Deutschland

Tagungsband: MikroSystemTechnik Kongress 2021

Seiten: 4Sprache: EnglischTyp: PDF

Kulkarni, Amit; Laske, Norman; Schulz-Walsemann, Arne-Veit; Kuehl, Anja; Hagge, Juergen; Meyenburg, Ingo; Quenzer, Hans-Joachim (Fraunhofer-Institut für Siliziumtechnologie ISIT, Itzehoe, Germany)

This paper presents a novel technology platform to fabricate miniaturized Silicon optics by embedding hundreds of Si spheres on wafer level. The exact curvature of spherical preforms which are subsequently grinded to form a plano-convex lens, promises excellent optical properties for IR spot detectors and could eliminate the need for expensive 100 % optical measurements in manufacturing. The transmission properties of the Si lenses were evaluated using a commercially available IR sensor. The technology provides a new dimension to product designers on the system level and could ease the integration of IR sensors into consumer elec tronics.