Assembly of Single-nanowires by Combining Soft Transfer and Surface Controlled Contact Printing
Konferenz: MikroSystemTechnik Kongress 2021 - Kongress
08.11.2021 - 10.11.2021 in Stuttgart-Ludwigsburg, Deutschland
Tagungsband: MikroSystemTechnik Kongress 2021
Seiten: 4Sprache: EnglischTyp: PDF
Salimitari, Parastoo; Reuter, Christoph; Kroetschl, Anja; Strehle, Steffen (Technische Universität Ilmenau, Microsystems Technology Group, Ilmenau, Germany)
To perform precise 2D assembly of single-nanowires (NWs) grown in a bottom-up manner on a target substrate, we present a transfer technique by combining a soft transfer printing (STP) strategy and surface controlled contact printing (SCCP) within a single platform. This platform is an in-house built three-axis tool with vertical force-control exploited for applying pressure during the SCCP process to transfer NWs on the target substrate. The vertical stage can be further used for detaching aligned NWs and transferring them to another substrate by STP strategy. This technique assembles single NWs on the surface and avoids mechanical substrate wear and undesired particle contamination.