Cu complex inks for printed electronics application-challenges and solutions
Konferenz: Mikro-Nano-Integration - 9. GMM-Workshop
21.11.2022 - 22.11.2022 in Aachen, Germany
Tagungsband: GMM-Fb. 105: Mikro-Nano-Integration
Seiten: 5Sprache: EnglischTyp: PDF
Mohan, Nihesh; Saccon, Rodolfo; Bhogaraju, Sri Krishna; Elger, Gordon (Institute of Innovative Mobility (IIMo), Technische Hochschule Ingolstadt, Germany)
A facile Cu complex ink is developed for printed electronics application as a cost-effective alternative to commercial nanoparticle inks. These inks are developed through combination of metal salts as precursors and amine based complexing agents, for lowering of decomposition temperature of metal salts. They don’t have the issues of agglomeration and storage, and during thermal decomposition there is an in-situ generation of Cu nanoparticles. In this paper, challenges related to this ink in terms of printability and sinterability is presented. Subsequent solutions related to ink design for inkjet printing and sinter process design and development is discussed.