Robust Power Module for High Power Density

Konferenz: Baulemente der Leistungselektronik und ihre Anwendungen 2023 - ETG-Fachtagung
20.06.2023-21.06.2023 in Bad Nauheim, Germany

Tagungsband: ETG-Fb. 171: Bauelemente der Leistungselektronik und ihre Anwendungen 2023

Seiten: 6Sprache: EnglischTyp: PDF

Siwak, Olga; Forndran, Freerik; Greif, Andreas; Leicht, Markus; Moenius, Petra; Teuber, Erik (Vitesco Technologies Germany GmbH, Nürnberg, Germany)
Hammerl, Matthias (Vitesco Technologies GmbH, Regensburg, Germany)

Many papers in power electronics discuss various approaches for lifetime estimation of power modules. Most of them are based on the widely studied LESIT and CIPS08 models which focus on base plate power modules with soldered dies and aluminum wire bonding. The introduction of Silicon Carbide MOSFETs creates the need of other interconnection technologies than the mentioned standard. Two of those are considered in this paper: die sintering plus ribbon bonding and die embedding. Furthermore, a wide range of automotive applications show a significant number of cycles with low temperature swings, which is not covered by the established models. A newly introduced approach for lifetime estimation based on validated FEM simulation results is given in this paper.