The Status of LEEPL: Can it be an alternative solution?

Konferenz: EMLC 2006 - 22nd European Mask and Lithography Conference
23.01.2006 - 26.01.2006 in Dresden, Germany

Tagungsband: EMLC 2006

Seiten: 7Sprache: EnglischTyp: PDF

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Utsumi, Takao (Nanolith LLC, 7-6-803, Sanbancho, Chiyoda-ku, Tokyo, Japan 102-0075)

The concept of LEEPL is based on the discovery that there is a narrow energy space around 2KV of e-beam proximity lithography where a potential solution for NGL exists. LEEPL Corporation and LEEPL Technology Consortium consisting 32 companies have been formed in 2000 and 2001 respectively for the purpose of developing LEEPL technology. The development has been carried out by (1) building α-tool, 2x β-tools, a pre-production model (LEEPL-3000) and (2) by building the infrastructure supporting LEEPL technology such as development and supply of LEEPL masks, resist materials, mask inspection and repair tools. Here LEEPL’s overall status and future prospect will be presented for the first time on the base of the past 5 years' intensive effort. The content of the presentation include LEEPL Development Overview, Exposure and Alignment Systems, Performance of Resolution, Resist Process, Throughput, and Cost of Ownership Comparison, and LEEPL Mask and Related Technologies. In conclusion the potential of LEEPL as an alternative solution for future semiconductor lithography beyond 45 nm node device application will be discussed.