Ten Steps to Solving Cooling Problems Cause by High-Density Server Deployment

Konferenz: Intelec '05 - Telecommunications Conference - 27th International Telecommunication Energy Conference
18.09.2005 - 22.09.2005 in Berlin, Germany

Tagungsband: Intelec '05 - Telecommunications Conference

Seiten: 8Sprache: EnglischTyp: PDF

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Hannaford, Peter (APC, UK)

High-density servers present a significant cooling challenge. Vendors are now designing servers that can demand over 20 kW of cooling per rack. With most data centers designed to cool an average of no more than 2 kW per rack, innovative strategies must be used for proper cooling of high-density equipment. This paper provides a ten-step approach for increasing cooling efficiency, cooling capacity, and power density in existing data centers.