Low temperature adhesive bonding: a novel technology for high-precision fabrication of BioMEMS
Konferenz: Mikrosystemtechnik Kongress 2005 - Mikrosystemtechnik Kongress 2005
10.10.2005 - 12.10.2005 in Munich, Germany
Tagungsband: Mikrosystemtechnik Kongress 2005
Seiten: 2Sprache: EnglischTyp: PDFPersönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Kentsch, Jörg; Breisch, Stefanie; Stelzle, Martin (Naturwissenschaftliches und Medizinisches Institut, Markwiesenstrasse 55, 72770 Reutlingen, Germany)
A novel adhesive bonding technology has been developed based on the preparation of ultrathin adhesive layers and print transfer onto micro-machined substrates (1). In contrast to many existing bonding technologies, this process is compatible to bio-functionalized devices since it operates at low temperatures and does not rely on cover plates previously pre-coated with adhesive. The process was initially developed for the bonding of glass/SU-8 structures to glass cover plates for the fabrication of micro-fluidic devices with integrated 3D-microelectrode arrays. Precision of alignment is usually <2micrometer. In addition, larger (6 inch) polymeric substrates with micro-machined channels have also successfully been bonded using this method.